Singaporean chiplet specialist plans new fabrication website in Italy

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Silicon Field, a complicated packaging upstart centered on chiplets, is shifting to Italy after organising a $2 billion packaging facility in Singapore in July 2023. The chiplet specialist has introduced to arrange one other manufacturing facility in Northern Italy to cater to Europe’s current and deliberate wafer fabrication clusters in France, Germany, and Italy.

Whereas fabs like TSMC and Samsung Foundry in addition to OSATs reminiscent of Amkor and ASE Know-how are eying alternatives in chiplets enterprise amid their experience in superior packaging applied sciences, what makes Silicon Field distinguished is its sole concentrate on chiplet fabrication and packaging.

For a begin, Silicon Field claims to carry efficient chiplet integration capabilities by way of its Singapore website. It’s essential to notice that whereas the Singapore-based agency makes a speciality of superior packaging applied sciences like different OSATs, it makes use of panel packaging as a substitute of normal wafer method. The panel-level manufacturing results in larger yield and is tailor-made for chiplet interconnects.

In different phrases, Silicon Field’s superior packaging capabilities are usually not restricted to chiplet integration; the corporate employs superior interconnection by way of proprietary, large-format manufacturing. So, its standardized packaging course of facilitates the shortest chiplet-to-chiplet interconnection with higher thermal and electrical efficiency.

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The brand new chiplet manufacturing facility in Italy plans to duplicate Silicon Field’s foundry in Singapore.

Silicon Field’s subsequent hop to Italy reveals that the upstart based by Marvell co-founders in 2021 is assured within the rising demand for chiplets and their manufacturing capability. The agency plans to take a position $3.6 billion on this new chiplet manufacturing facility in Northern Italy whereas creating roughly 1,600 semiconductor jobs.

Furthermore, an in depth collaboration with European fabs will enhance resilience and value effectivity for the brand-new chiplet provide chain. A brand new chiplet packaging facility in Europe additionally bodes nicely for the ecosystem that’s nonetheless in its infancy and wishes extra centered efforts to make chiplet manufacturing viable.

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