[ad_1]
– Commercial –
The business’s first 12-stack HBM3E DRAM with 1,280 GB/s bandwidth and 36 GB capability is revolutionising AI purposes and high-performance computing.
Samsung Electronics, a pacesetter in reminiscence expertise, introduced the event of the HBM3E 12H, the business’s first 12-stack HBM3E DRAM and the highest-capacity HBM product.
The DRAM supplies a bandwidth of as much as 1,280 gigabytes per second (GB/s) and a 36 gigabytes (GB) capability, bettering each elements by greater than 50% in comparison with the 8-stack HBM3 8H. The HBM3E 12H makes use of thermal compression non-conductive movie (TC NCF), guaranteeing that the 12-layer merchandise keep the precise peak specification because the 8-layer ones to adjust to HBM bundle requirements. This expertise is anticipated to supply benefits for larger stacks because the business goals to handle chip die warping related to thinner die. Samsung has lowered the thickness of its NCF materials, attaining a chip hole of seven micrometres (µm) whereas eliminating voids between layers. These enhancements lead to a greater than 20% enhance in vertical density in comparison with the HBM3 8H product.
– Commercial –
Samsung’s TC NCF additionally enhances the thermal properties of the HBM by permitting bumps of various sizes between the chips. Smaller bumps are used for signalling in the course of the chip bonding course of, whereas bigger ones are positioned in areas requiring warmth dissipation. This method additionally contributes to larger product yield.
As AI purposes proceed to proliferate, the product is poised to be an answer for future techniques demanding extra reminiscence. Its efficiency and capability will allow prospects to handle their sources extra flexibly and cut back the full value of possession (TCO) for knowledge centres. In AI purposes, utilizing the HBM3E 12H, in comparison with the HBM3 8H, can enhance the typical pace of AI coaching by 34% and broaden the variety of simultaneous customers of inference providers by greater than 11.5 instances.
“The business’s AI service suppliers are more and more requiring HBM with larger capability, and our new HBM3E 12H product has been designed to reply that want,” mentioned Yongcheol Bae, Govt Vice President of Reminiscence Product Planning at Samsung Electronics.
For extra data, click on right here.
[ad_2]
Supply hyperlink
