Hynix to construct $3.9bn HBM packaging plant in Indiana

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Manufacturing is because of begin in H2 2028.

“We’re excited to turn out to be the primary within the business to construct a state-of-the-art superior packaging facility for AI merchandise in america that can assist strengthen provide chain resilience and develop an area semiconductor ecosystem,” says Hynix CEO Kwak Noh-Jung.M, “we consider this challenge will lay the inspiration for a brand new Silicon Heartland, a semiconductor ecosystem centered within the Midwest Triangle. This facility will create native, high-paying jobs and produce AI reminiscence chips with unmatched capabilities, in order that America can onshore extra of its important chip provide chain. We’re grateful for the help of Gov. Holcomb and the state of Indiana, of President Chiang at Purdue College, and of the broader neighborhood concerned, and we stay up for increasing our partnership in the long term.”

No reference has been made to any Chips Act cash that may have persuaded Hynix to make the funding.


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