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The information about Samsung snapping a complicated packaging order for Nvidia’s AI chips paired with high-bandwidth reminiscence (HBM) chips underscores the strategic significance of next-generation packaging options. In line with a report printed in South Korean media outlet The Elec, Samsung’s superior packaging group will present interposer and a pair of.5D packaging expertise for Nvidia’s AI processors.
It’s vital to notice that the GPU and HBM constructing blocks in these AI processors are equipped by different firms—more than likely Nvidia’s GPUs manufactured on a TSMC course of node and HBM chips designed and produced by Samsung’s archrival SK hynix.
What’s extra vital is how trade watchers relate this growth to the inadequate capability of TSMC’s chip-on-wafer-on-substrate (CoWoS) expertise, which stacks chips and packages them onto a substrate. Nevertheless, this provide scarcity linked with the current earthquake in Taiwan doesn’t maintain a lot weight, and it’s more than likely associated to provide and demand points.
Samsung calls its 2.5D packaging expertise iCube; it locations a number of logic dies equivalent to CPUs and GPUs and several other HBM dies on prime of a silicon interposer, making a number of dies function as a single chip in a single bundle. It deploys parallel and horizontal chip placement to spice up efficiency and fight warmth buildup.
04.09.2024
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Determine 1 The iCube expertise affords warpage management even with giant interposers, and its ultra-low sign loss is paired with excessive reminiscence density. Supply: Samsung
Samsung’s superior packaging pivot
Commerce media has been abuzz with experiences about Samsung beefing up its superior packaging division by hiring extra engineers and creating its personal interposer expertise. The corporate reportedly procured a considerable amount of 2.5D packaging tools from Japanese semiconductor tools provider Shinkawa.
One other report printed in The Elec claims that Utilized Supplies and Besi Semiconductor are putting in hybrid bonding tools at Samsung’s Cheonan Campus. Hybrid bonding enhances I/O and wiring lengths in comparison with present bonding strategies. TSMC affords hybrid bonding in its 3D packaging companies referred to as System on Built-in Chip (SoIC). Intel has additionally carried out hybrid bonding expertise in its 3D packaging expertise referred to as Foveros Direct.
Media experiences recommend that Samsung has lately ramped up the manufacturing capability at its key website for superior manufacturing in Cheonan to full utilization previous Nvidia’s superior packaging orders. Trade observers additionally count on that this superior packaging cope with Nvidia might pave the best way for Samsung to win the availability of HBM chips for pairing with GPU’s maker’s AI units.
SK hynix is at the moment the foremost provider of HBM chips for Nvidia’s AI processors, and Samsung is frantically working to shut the hole. The truth is, when Samsung established the superior packaging enterprise group in December 2023, the corporate’s co-CEO Kye-Hyun Kyung hinted about seeing the outcomes of this funding within the second half of 2024.
Superior packaging in Samsung’s roadmap
Kyung additionally pinned his hopes on a aggressive benefit with Samsung’s reminiscence chips, chip fabrication, and chip design companies underneath one roof. Superior packaging stands out on this semiconductor expertise portfolio because of its intrinsic hyperlink to giant and highly effective AI chips and system-in-package (SiP) units.
Determine 2 Subsequent-generation packaging applied sciences are within the limelight as a result of huge demand for AI chips. Supply: Samsung
Like TSMC and Intel Foundry, Samsung is aggressively investing in superior packaging applied sciences like silicon interposers whereas additionally steadily increasing its manufacturing capability. Fascinating instances are forward for next-generation packaging options.
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